New Dense-Pac Exec

Garden Grove-based Dense-Pac Microsystems Inc. named former Toshiba America executive Ted G. Bruce as its president.

Bruce joins Dense-Pac Monday after spending nine years at Irvine-based Toshiba America Electronic Components, where he recently served as senior manager of North America manufacturing.

Dense-Pac makes technology for stacking computer chips, which allows a large amount of memory to be packed into a small space. In July, the company signed a contract with Toshiba America Electronic Components for an undisclosed amount to produce a series of high-density memory products for its line of computers.

Richard Dadamo, who has served as Dense-Pac’s interim president and chief executive officer since August, will remain CEO. Dadamo also joined the Dense-Pac board of directors, increasing the board’s size to six.